| 摘要 |
<p>A bonding head and a bonding device using the bonding head. The bonding head comprises a bonding head main body (10), a bonding surface (W) being provided on the bonding head main body (10), multiple groove structures (20) being provided on the bonding surface (W), and the tops of the groove structures (20) being flush, to form multiple protruding structures (21). The multiple groove structures (20) extend between two opposite sides of the bonding surface (W), so that the bonding surface (W) of the bonding head is partitioned. The bonding head solves the problem of a short cut in connection between two adjacent chip terminals during chip installation.</p> |
