发明名称 SUBSTRATE INSPECTION APPARATUS AND SUBSTRATE DELIVERY METHOD
摘要 PROBLEM TO BE SOLVED: To provide a substrate inspection apparatus which delivers a substrate while securely holding the substrate, and to provide a substrate delivery method.SOLUTION: A substrate inspection apparatus 1 includes: a placement base 4a having multiple vacuum suction pads 61 for suctioning a wafer W; and a rear surface arm 10. The rear surface arm 10 includes: multiple vacuum suction pads 71 which conducts vacuum suction from an opening 42a2 to suction the wafer W; and multiple suction pads 72 which blow a predetermined gas from a pair of jet ports 41a to generate a negative pressure between themself and the wafer W and suction the wafer W.
申请公布号 JP2014197651(A) 申请公布日期 2014.10.16
申请号 JP20130073599 申请日期 2013.03.29
申请人 OLYMPUS CORP 发明人 OKAHIRA HIROYUKI;MOCHIZUKI TOSHIHIRO
分类号 H01L21/683;H01L21/66;H01L21/677 主分类号 H01L21/683
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