发明名称 |
SUBSTRATE INSPECTION APPARATUS AND SUBSTRATE DELIVERY METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a substrate inspection apparatus which delivers a substrate while securely holding the substrate, and to provide a substrate delivery method.SOLUTION: A substrate inspection apparatus 1 includes: a placement base 4a having multiple vacuum suction pads 61 for suctioning a wafer W; and a rear surface arm 10. The rear surface arm 10 includes: multiple vacuum suction pads 71 which conducts vacuum suction from an opening 42a2 to suction the wafer W; and multiple suction pads 72 which blow a predetermined gas from a pair of jet ports 41a to generate a negative pressure between themself and the wafer W and suction the wafer W. |
申请公布号 |
JP2014197651(A) |
申请公布日期 |
2014.10.16 |
申请号 |
JP20130073599 |
申请日期 |
2013.03.29 |
申请人 |
OLYMPUS CORP |
发明人 |
OKAHIRA HIROYUKI;MOCHIZUKI TOSHIHIRO |
分类号 |
H01L21/683;H01L21/66;H01L21/677 |
主分类号 |
H01L21/683 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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