发明名称 FLUX FOR LEAD-FREE SOLDER FOR CLEARANCE RESIST, AND LEAD-FREE SOLDER PASTE FOR CLEARANCE RESIST
摘要 <p>PROBLEM TO BE SOLVED: To provide flux that increases wettability of lead-free solder metal on a clearance resist in the atmosphere.SOLUTION: Flux for lead-free solder paste for a clearance resist comprises a rosin-based base resin (A), a solvent (B) and an activator (C). The (A) component comprisesα,βunsaturated carboxylic acid-modified rosin (a1). The (B) component is a propylene glycol-based ether (b1) with a boiling point of 275°C or less. The (C) component is a dibasic acid (c1) represented by the general formula (1) defined by HOOC-R-COOH, where R is a C2-C4 hydrocarbon group.</p>
申请公布号 JP2014195830(A) 申请公布日期 2014.10.16
申请号 JP20140006250 申请日期 2014.01.16
申请人 ARAKAWA CHEM IND CO LTD 发明人 KUBO NATSUKI;ISHIGA FUMIO;SAKASHITA SATOSHI
分类号 B23K35/363 主分类号 B23K35/363
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