Composition and Method of Application to Reduce Magnetostriction Losses in Encapsulated Microelectronic Components

摘要

A buffer material protects a microelectronic device in space constrained environments, for improved efficiency with respect to magnetostrictive materials therein, and includes a gas filled polymer shell microsphere carried in an elastomeric polymer binder. Expanded Expancel microspheres being less than 20 microns in diameter form 80% of the composition by volume. The polymer binder is a low viscosity dimethyl silicone with a hardness of less than 25. Coating thicknesses may be based upon the overall expected dimensional changes of the encapsulation material, due to its coefficient of thermal expansion and an expected operating temperature range of the component, plus the expected shrinkage of that encapsulation material during polymerization and the overall mass which shall be exerting a force upon the magnetic core, plus the dimensional changes of the component as a result of the flux density resulting in magnetostriction of the magnetic core.

主权项

1. A method of reducing the adverse effects of encapsulating magnetostrictive materials of microelectronic components, said method comprising:
creating a first coating material having a high viscosity where said material is non-flowable, said first coating material comprising:
a gas filled polymer shell microsphere carried in an elastomeric polymer binder;said polymer shell being less than 20 microns in diameter, and comprising 80% by volume of said buffer material;said elastomeric polymer binder comprising a low viscosity dimethyl silicone with a hardness of less than 25; adding solvent to said first coating material to produce a second coating material having a low viscosity where said material is flowable; filling a first syringe with said second coating material; dispensing said second coating material from said first syringe for filling the space between a microelectronic component and a circuit board, between the mounting legs of the microelectronic component; filling a second syringe with said first coating material; and dispensing said first coating material from said second syringe for providing a layer of material around the perimeter of the microelectronic component.