| 发明名称 |
CHIP ON FILM AND DISPLAY DEVICE HAVING THE SAME |
| 摘要 |
A flexible chip on film includes a base insulating layer, a metal layer disposed on an upper surface of the base insulating layer and including a circuit pattern, an integrated circuit chip disposed on an upper surface of the metal layer and electrically connected to the metal layer, a solder resist layer disposed on the metal layer and insulated from the integrated circuit chip, and a reinforcing layer disposed on an upper surface of the solder resist layer. When the chip on film COF is bent, a neutral surface, in which a vector sum of a tensile force and a compressive force becomes substantially zero, is placed in the metal layer. |
| 申请公布号 |
US2014306348(A1) |
申请公布日期 |
2014.10.16 |
| 申请号 |
US201314021302 |
申请日期 |
2013.09.09 |
| 申请人 |
Samsung Display Co., Ltd. |
发明人 |
Ahn Hyeong-Cheol |
| 分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A flexible chip on film comprising:
a base insulating layer; a metal layer disposed on an upper surface of the base insulating layer and including a circuit pattern; an integrated circuit chip disposed on an upper surface of the metal layer and electrically connected to the metal layer; a solder resist layer disposed on the metal layer and electrically insulated from the integrated circuit chip; and a reinforcing layer disposed on an upper surface of the solder resist layer, wherein a neutral surface, in which a vector sum of a tensile force and a compressive force becomes substantially zero when the chip on film COF is bent, is placed in the metal layer. |
| 地址 |
Yongin-City KR |
