| 摘要 |
<p>[Problem] To provide: a material which is for three-dimensional molding and on which a conductive pattern that exhibits excellent adhesiveness even after the three-dimensional molding can be formed; and a process for producing a three-dimensional conductive pattern structure, said process using this material for three-dimensional molding and necessitating no special apparatus. [Solution] This three-dimensional conductive pattern structure is produced by: using a material which is for three-dimensional molding and which has, in at least a part thereof, a surface made of a polyimide resin; conducting, in a surface portion (1) made of a polyimide resin, the formation of a modified pattern and then the adsorption and reduction of metal ions to form a material which is provided with a pattern (2) having a plating-catalyzing activity; and subjecting the material which is provided with the pattern (2) to three-dimensional molding and electroless plating successively.</p> |
