发明名称 POLISHING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a polishing device which prevents liquid supply pipelines connected with a polishing table from being damaged when the polishing table conducts translational movement along a circular orbit.SOLUTION: A polishing device includes: a polishing table 10 which has a polishing surface 16a and conducts translational movement along a circular orbit; a top ring 28 which presses a substrate W to the polishing surface 16a; a drive shaft 20 connected with the polishing table 10; a protection pipe 65 extending inside the drive shaft 20; liquid supply pipelines 60, 61 extending inside the protection pipe 65 and connected with a lower surface of the polishing table 10; and a support member 68 supporting the liquid supply pipelines 60, 61 in the protection pipe 65.
申请公布号 JP2014195837(A) 申请公布日期 2014.10.16
申请号 JP20130071773 申请日期 2013.03.29
申请人 EBARA CORP 发明人 USHIMARU SEIYA;TANAKA TOMOHIRO;SONE CHUICHI
分类号 B24B37/00;H01L21/304 主分类号 B24B37/00
代理机构 代理人
主权项
地址