HEATING SYSTEM AND METHOD FOR MICROFLUIDIC AND MICROMECHANICAL APPLICATIONS

摘要

An integrated semiconductor heating assembly includes a semiconductor substrate, a chamber formed therein, and an exit port in fluid communication with the chamber, allowing fluid to exit the chamber in response to heating the chamber. The integrated heating assembly includes a first heating element adjacent the chamber, which can generate heat above a selected threshold and bias fluid in the chamber toward the exit port. A second heating element is positioned adjacent the exit port to generate heat above a selected threshold, facilitating movement of the fluid through the exit port away from the chamber. Addition of the second heating element reduces the amount of heat emitted per heating element and minimizes thickness of a heat absorption material toward an open end of the exit port. Since such material is expensive, this reduces the manufacturing cost and retail price of the assembly while improving efficiency and longevity thereof.

主权项

1. A method of making a print head for an inkjet print cartridge, comprising:
forming electrically insulating regions within a semiconductor substrate; forming a heat responsive chamber in the semiconductor substrate, the chamber having a bottom; forming an inlet path to the chamber, the inlet path configured to receive fluid; forming an outlet path in fluid communication with the chamber and a surrounding environment; forming a first heating element adjacent to the chamber bottom, the first heating element being configured to generate heat when subjected to an electrical current; and forming a second heating element adjacent to the outlet path of the chamber, the second heating element being configured to generate heat when subjected to an electrical current.