ENCAPSULATION PROCESS, AND DEVICE ASSOCIATED THEREWITH

摘要

PROBLEM TO BE SOLVED: To provide an encapsulation process for electrically connecting an encapsulated component, and an electronic component.SOLUTION: The invention relates to an encapsulation process for an electronic component (2). The component (2) is connected to an electrical contact track composed of a metal layer (101). The process according to the invention comprises the following steps: deposition of a titanium nitride layer (102) directly on at least part of the electrical contact track (101); and deposition of an aluminium oxide layer (4) by atomic layer deposition, such that the encapsulation layer (4) directly covers the titanium nitride layer (102). The process according to the invention enables electrical contact through the encapsulation layer (4). The invention also relates to an electronic device obtained using such a process.