| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a lead frame substrate for LED and a lead frame for LED which suppress occurrence of filling failures in the neighborhood of a pad part or electrode part when resin molding of a lead frame substrate for LED is performed by a transfer molding method.SOLUTION: A lead frame for LED has a pad part on which an LED chip is mounted, and an electrode part which is electrically connected to the LED chip. In the cross-sectional shape of the pad part and the electrode part on a plane parallel to a surface of the pad part on which the LED chip is mounted, or a surface of the electrode part which is electrically connected to the LED chip, the width of the cross-sectional shape in a direction orthogonal to the direction in which melted resin flows when resin is molded integrally with the lead frame for LED by a transfer molding method decreases along the resin flowing direction.</p> |
