发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR MODULATOR, SEMICONDUCTOR MODULATOR
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor modulator including a pad electrode having a good adhesion property for a structure of embedding an optical waveguide using resin.SOLUTION: A base structure 28 includes a second portion 24b and a metal body 30 of an inorganic insulation layer 24, and contacts a second area 13c and supports a pad electrode. An inorganic insulation layer 24(24b) in the base structure 28 extends on a second area 13a while contacting the second area 13a, and is connected to an inorganic insulation layer 24(24a) extending below a resin body 25. Portions 24b and 24a of the inorganic insulation layer 24 are simultaneously deposited. The inorganic insulation layer 24 can fix the metal body 30 to a substrate 13 firmly. The resin body 25 is provided on at least a part of the edge of the metal body 30 so as to firmly press the metal body 30 onto the substrate 13. The top face of the metal body 30 is in contact with the resin body 25 and with the inorganic insulation layer 24.
申请公布号 JP2014197150(A) 申请公布日期 2014.10.16
申请号 JP20130073342 申请日期 2013.03.29
申请人 SUMITOMO ELECTRIC IND LTD 发明人 YAGI HIDEKI;KITAMURA TAKAMITSU;KOBAYASHI HIROHIKO;YONEDA MASAHIRO
分类号 G02F1/025 主分类号 G02F1/025
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