| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which can effectively reduce a potential difference between metal lead-out wires, and inhibit the occurrence of ion migration between the metal lead-out wires composed of silver, copper or the like, and promote downsizing and microfabrication of wires and narrowing of each space between wires to a further degree.SOLUTION: In a wiring board having a plurality of metal wires arranged on an insulating substrate, and a transparent adhesive layer arranged on the metal wires in direct contact with the metal wires, the metal wires include a first metal wire to which a pulse signal is supplied and a second metal wire to which fixed potential is applied, and the pulse signal has a pulse train in which a plurality of pulses having a reference level the same with the level of the fixed potential and a pulse width of 3 msec and under and an integrated time of the pulses in 600 seconds is less than 60 seconds. |
