发明名称 |
SOLDER PRINT INSPECTING DEVICE |
摘要 |
A solder print inspecting device includes three-dimensional measurement lighting unit that directs a specific light at a printed substrate, a CCD camera for imaging the printed substrate that is illuminated by the light, three-dimensional calculating unit that performs a three-dimensional measurement of cream solder based on image data, etc., and displaying unit that displays a three-dimensional image showing a three-dimensional shape of the cream solder, along with displaying an arrow image showing an operating direction of a squeegee in a solder printing machine, an arrow image showing a conveying direction of the printed substrate, etc. |
申请公布号 |
US2014307948(A1) |
申请公布日期 |
2014.10.16 |
申请号 |
US201414245968 |
申请日期 |
2014.04.04 |
申请人 |
Kamioka Yosuke |
发明人 |
Kamioka Yosuke |
分类号 |
G06T7/00 |
主分类号 |
G06T7/00 |
代理机构 |
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代理人 |
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主权项 |
1. A solder print inspecting device for inspecting solder printed on a substrate by a solder printing machine, comprising:
lighting unit that directs a specific light toward the substrate; imaging unit that images the substrate illuminated with the light; three-dimensional calculating unit that performs a three-dimensional measurement of the solder based on image data imaged by the imaging unit; inspecting unit that performs an inspection of the solder based on a value measured by the three-dimensional calculating unit; and image processing unit that performs a process for displaying, on specific displaying unit, a three-dimensional image showing a three-dimensional shape of the solder viewed from an arbitrary viewing direction based on a value measured by the three-dimensional calculating unit; wherein the image processing unit performs a process for displaying a direction image, showing an operating direction of a specific operation performed by the solder printing machine on the substrate, together with the three-dimensional image of the solder. |
地址 |
Aichi JP |