发明名称 SOLDER PRINT INSPECTING DEVICE
摘要 A solder print inspecting device includes three-dimensional measurement lighting unit that directs a specific light at a printed substrate, a CCD camera for imaging the printed substrate that is illuminated by the light, three-dimensional calculating unit that performs a three-dimensional measurement of cream solder based on image data, etc., and displaying unit that displays a three-dimensional image showing a three-dimensional shape of the cream solder, along with displaying an arrow image showing an operating direction of a squeegee in a solder printing machine, an arrow image showing a conveying direction of the printed substrate, etc.
申请公布号 US2014307948(A1) 申请公布日期 2014.10.16
申请号 US201414245968 申请日期 2014.04.04
申请人 Kamioka Yosuke 发明人 Kamioka Yosuke
分类号 G06T7/00 主分类号 G06T7/00
代理机构 代理人
主权项 1. A solder print inspecting device for inspecting solder printed on a substrate by a solder printing machine, comprising: lighting unit that directs a specific light toward the substrate; imaging unit that images the substrate illuminated with the light; three-dimensional calculating unit that performs a three-dimensional measurement of the solder based on image data imaged by the imaging unit; inspecting unit that performs an inspection of the solder based on a value measured by the three-dimensional calculating unit; and image processing unit that performs a process for displaying, on specific displaying unit, a three-dimensional image showing a three-dimensional shape of the solder viewed from an arbitrary viewing direction based on a value measured by the three-dimensional calculating unit; wherein the image processing unit performs a process for displaying a direction image, showing an operating direction of a specific operation performed by the solder printing machine on the substrate, together with the three-dimensional image of the solder.
地址 Aichi JP