发明名称 HOT-ROLLED COPPER PLATE
摘要 This hot-rolled copper plate is made from pure copper having a purity of 99.99 mass% or greater, the average crystal grain diameter being 40 μm or less, and the (&Sgr;3+&Sgr;9) grain boundary length ratio (L(&sgr;3 + &sgr;9)/L), which is the ratio between the total crystal grain boundary length (L) measured by the EBSD method and the sum (L(&sgr;3 + &sgr;9)) of the &Sgr;3 grain boundary length (L&sgr;3) and the &Sgr;9 grain boundary length (L&sgr;9) is 28% or greater.
申请公布号 WO2014168132(A1) 申请公布日期 2014.10.16
申请号 WO2014JP60151 申请日期 2014.04.08
申请人 MITSUBISHI MATERIALS CORPORATION 发明人 MAKI KAZUNARI;MORI HIROYUKI;ARAI ISAO;IIDA NORIHISA;TAKEDA TAKAHIRO;SHIMOIZUMI SHIGERU;OIKAWA SHIN
分类号 C22C9/00;B21B3/00;C22F1/00;C22F1/08;C23C14/34;H01B1/02;H01B5/02 主分类号 C22C9/00
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