| 摘要 |
Disclosed are a memory card system and a method for manufacturing the same. The memory card system comprises: a flexible integrated circuit element package which is made of a bendable or foldable flexible material and includes an electrically connectable connection pad; an upper flexible case which is made of a bendable or foldable flexible material and is arranged to cover the upper part of the flexible integrated circuit element package; a lower flexible case which is made of a bendable or foldable flexible material, faces to the upper case to include the flexible integrated circuit element package, and is arranged to cover the lower part of the flexible integrated circuit element package; a wire unit which is made of a bendable or foldable flexible material, and includes a connection wire mounted in the internal surface of the upper flexible case to electrically connect the flexible integrated circuit element package and an external device, a connection pin mounted in the external surface of the upper flexible case, and a via wire to penetrate the upper flexible case between the connection wire and the connection pin; and an anisotropic conductive film which is included between the connection pad and the connection wire to electrically connect the connection pad and the connection wire in only the direction of facing each other. |
