| 摘要 |
<p>Provided is flux which is capable of suppressing increase in the viscosity of solder paste during its storage and is also capable of improving the fusibility of a solder alloy. In the flux which contains an activator and a solvent and forms solder paste by being mixed with a granular solder alloy, this flux contains a solvent of monoalkyl propylene glycol series. It is preferable that the solvent of monoalkyl propylene glycol series is butyl propylene triglycol or butyl propylene diglycol. It is also preferable that a contented amount of the solvent of monoalkyl propylene glycol series is equal to or more than 75% but equal to or less than 100% relative to a contented amount of all the solvents.</p> |
