| 摘要 |
The invention relates to an electroplating device and, more particularly, to the electro plating device which reduces the anode-cathode distance to improve a deviation of plated thickness. The invention comprises a cathode to which a jig and a substrate are fixed; a nozzle pipe which injects the plating solution onto the surface fixed to the cathode; an anode case which includes an inserting hole for inserting the nozzle pipe and includes an anode inserting unit in both sides of inserting hole; an anode which is inserted into the anode inserting unit of anode case; and a shield which is installed closely to the anode inserting unit to block the hydrogen gas generated from the anode. |
