发明名称
摘要 PROBLEM TO BE SOLVED: To provide a method for producing moldings which requires no large scale conveyance facilities, a device for producing moldings, and a mold used for the method and device.SOLUTION: A cavity 5 is formed of a first mold 2, a second mold 3, and a mold component 1 to be fixed to the second mold 3 in freely attachable/detachable manner. The molding process fixes the mold component 1 heated above a predetermined temperature in the heating process to the second mold 3 while the first mold 2 and the second mold 3 are kept above the predetermined temperature and then injects the molding material into the cavity 5. The unloading process isolates the first mold 2 and the second mold 3 and unloads the moldings 51 from the second mold 3 while they are embraced by the mold component 1. The cooling process is to cool the unloaded moldings 51. The release process removes the cooled moldings 51 from the mold component 1. The heating process heats the removed mold component 1 above the predetermined temperature. The mold component 1 is treated in each process by allowing the mold component 1 to pass through a round of processes.
申请公布号 JP5606377(B2) 申请公布日期 2014.10.15
申请号 JP20110084185 申请日期 2011.04.06
申请人 发明人
分类号 B29C45/73;B29C45/04 主分类号 B29C45/73
代理机构 代理人
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