| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a crystal oscillator capable of being cut into a high precision chip. <P>SOLUTION: A method of manufacturing a crystal oscillator includes the steps of: preparing a crystal plate having a predetermined thickness; calculating the size of a crystal oscillator chip to be cut out based on the thickness of the prepared crystal plate and the volume of the crystal oscillator chip for oscillating a desired frequency; forming a modified layer in the crystal plate by radiating a laser beam whose wavelength has transparency to the crystal plate with the light focusing point being positioned in the crystal plate based on the size calculated in the size calculation step; and dividing the layer into individual crystal oscillator chips by applying an external force to the crystal plate after performing the modified layer forming step. <P>COPYRIGHT: (C)2012,JPO&INPIT |
