发明名称 METAL BASED SOLDER COMPOSITE INCLUDING CONDUCTIVE SELF-HEALING MATERIALS
摘要 <p>The present invention provides a solder containing electroconductive self-restoration substances. According to an aspect of the present invention, the solder comprises: a metal based solder matrix; capsules dispersed in the solder matrix; and self-resotration substances stored in the capsules, and capable of forming electroconductive metal compounds by reacting with the solder matrix when being in contact with the solder matrix.</p>
申请公布号 KR20140121190(A) 申请公布日期 2014.10.15
申请号 KR20130037650 申请日期 2013.04.05
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHU, KUN MO;MOON, CHANG YOUL;LEE, SUNG HEE;HWANG, JUN SIK
分类号 B23K35/26;B23K35/36 主分类号 B23K35/26
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