METAL BASED SOLDER COMPOSITE INCLUDING CONDUCTIVE SELF-HEALING MATERIALS
摘要
<p>The present invention provides a solder containing electroconductive self-restoration substances. According to an aspect of the present invention, the solder comprises: a metal based solder matrix; capsules dispersed in the solder matrix; and self-resotration substances stored in the capsules, and capable of forming electroconductive metal compounds by reacting with the solder matrix when being in contact with the solder matrix.</p>
申请公布号
KR20140121190(A)
申请公布日期
2014.10.15
申请号
KR20130037650
申请日期
2013.04.05
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
CHU, KUN MO;MOON, CHANG YOUL;LEE, SUNG HEE;HWANG, JUN SIK