| 发明名称 |
RESIN COMPOSITION FOR COPPER CLAD LAMINATE, AND RESIN COATED COPPER AND COPPER CLAD LAMINATE USING THE SAME |
| 摘要 |
<p>The present invention relates to a resin composition containing a high-equivalent epoxy resin, a low-equivalent epoxy resin, and a tetrafunctional epoxy resin; a resin coated copper (RCC) using the resin composition; a copper clad laminate using the RCC and a glass fiber nonwoven fabric (glass web) substrate; and a method for manufacturing the copper clad laminate.</p> |
| 申请公布号 |
KR20140121047(A) |
申请公布日期 |
2014.10.15 |
| 申请号 |
KR20130037201 |
申请日期 |
2013.04.05 |
| 申请人 |
DOOSAN CORPORATION |
发明人 |
LEE, HANG SEOK;HAN, DUK SANG;KIM, SUNG MOON;PARK, IL GEUN;MOON, SUNG JOON |
| 分类号 |
C08L63/02;B32B15/092;B32B37/10;C08G59/18 |
主分类号 |
C08L63/02 |
| 代理机构 |
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