| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor wafer which downsizes a semiconductor chip. SOLUTION: The semiconductor wafer includes a semiconductor substrate 21 which has a plurality of chip forming regions 23 on each of which a semiconductor device 24 is formed, and inter-layer insulation films 50-80, on which an inspection pad 41a and a signal pad 41b are formed, on one surface. The signal pad 41b is arranged at a location facing the semiconductor device 24 and electrically connected with the semiconductor device 24 through vias 52c-82c formed inside the inter-layer insulation films 50-80. An inspection wire 61c is provided at a position between the signal pad 41b and the semiconductor device 24 inside the inter-layer insulation films 50-80, and the inspection pad 41a and the signal pad 41b are electrically connected through the inspection wire 61c. COPYRIGHT: (C)2012,JPO&INPIT |
