In-line apparatus having an automatic test equipment using a light signal and dicing equipment and operation method thereof

摘要

PURPOSE: An inline apparatus and an operation method thereof are provided to perform an electrical inspection process and dicing process in one apparatus with a non-contact method, thereby improving manufacturing efficiency. CONSTITUTION: A semiconductor wafer is inserted into a loading part. An inspection part performs an electrical inspection process with respect to the semiconductor wafer through an optical signal and wireless power. A dicing part(600) separates an individual semiconductor chip from the inspection-completed semiconductor wafer. An transport unit(500) transfers the semiconductor wafer from the inspection part to the dicing part. An unloading part(700) discharges the dicing-completed semiconductor wafer to the outside of equipment. The semiconductor wafer comprises an optical signal transceiver part and wireless power generation part in the inside.