| 摘要 |
An electronic device comprises a circuit substrate (5), and a moulded interconnect device (4) incorporating integral legs (8) to mount the interconnect device upon the substrate, the legs spacing at least one of the legs carrying a conducting track (20, 21, 22) to provide an electrical interconnection between the interconnect device and the substrate. The substrate (5) may comprise another moulded interconnect device and may be mounted upon a processor (3) and may include an electromagnetic shield (30) on its lower surface. |
