| 摘要 |
A contact smart card (100, 101) comprises a smart card contact pad (10) and an IC chip (200, 300). The smart card contact pad 10 includes an imageable circuit substrate (12), a card-reader contact element (14) on a first side (16) of the imageable circuit substrate (12), and a, preferably flip-chip, connection element (18) on a second side (20) of the imageable circuit substrate (12) which is opposite the first side (16). The card-reader contact element (14) has a noble metal electrically conductive surface (30), and the connection element (18) has a chip terminal connection surface (36) which is not a noble metal. The IC chip (200, 300) is preferably flip-chip mounted at the second side (20) of the imageable circuit substrate (12) and electrically connected to the chip terminal connection surface (36). Furthermore, the chip terminal connection surface is preferably an organometallic electrically conductive corrosion protection layer. |
