| 摘要 |
<p>The present invention relates to a printed circuit board and a manufacturing method thereof. The printed circuit board includes a substrate, a patterned wiring layer which is formed on the upper side of the substrate and is formed by the printing method of a conductive paste composition, a patterned wiring layer which is formed on the lower side of the substrate and is formed by the printing method of the conductive paste composition, one or more via holes which electrically connect the patterned wiring layer which is formed on the upper side of the substrate and the patterned wiring layer which is formed on the lower side of the substrate, and vias connecting the via holes. wherein each of the vias has a through hole which passes through the upper and lower sides and of which diameter is smaller than the diameter of the via. Metal plating layers are formed on the surface of the through hole and the patterned wiring layers which are formed on the upper and lower sides of the substrate by metal plating.</p> |
