LED PACKAGE WITH OVERFLOW PROTECTION STRUCTURE OF ENCAPSULANT

摘要

Provided is an LED package with a structure capable of preventing the overflow of an encapsulant, wherein an overflow preventing structure for preventing the loss of the encapsulant is installed on the surface of the LED package during a process of molding the encapsulant or during curing after molding, so that optical properties of the LED package can be improved and obstacles in the processes can be reduced. To this end, the LED package with an overflow preventing structure comprises an LED chip is mounted on a substrate in which a first electrode and a second electrode are installed, wherein the LED chip is connected to the first and second electrodes by a wire; a cavity which is installed in the upper portion of the substrate to form a reflector around the LED chip; and an encapsulant molded inside the cavity to protect the LED chip and wire. The LED package with the overflow preventing structure further comprises an overflow preventing unit which is installed on the top surface of the cavity to prevent the encapsulant from overflowing and being lost from the cavity. Therefore, it is possible to prevent degradation of the optical properties of the LED package and obstacles in the processes caused by the overflow of the encapsulant occurring during the process of molding the encapsulant or during curing after molding.