| 摘要 |
The present invention relates to a MEMS microphone which has a sound hole by a downward bending. The MEMS microphone includes: a cover which forms an internal space by being combined with a substrate and has at least one sound hole which is formed by having an upper cut section; a transducer which is installed in the internal space of the substrate and converts an external sound, which comes into the internal space through the sound hole, into an electrical signal; and a semiconductor chip which is installed in the internal space of the substrate, is electrically connected with the transducer, and amplifies an electrical signal in order to covert the converted electrical signal into an analog or digital electrical signal. The cut section on the cover forms a cut part by being bent downward, with one side of the cut part being connected with the cover, the other side of the cut part forming a space by being separated from the cover, and the space becomes the sound hole. |
