Stacked device identification assignment

摘要

Some embodiments include apparatus and methods having dice arranged in a stack. The dice include at least a first die and a second die, and a connection coupled to the dice. The connection may be configured to transfer control information to the first die during an assignment of a first identification to the first die and to transfer the control information from the first die to the second die during an assignment of a second identification to the second die.

主权项

1. An apparatus comprising:
a first die including a first logic component; a second die including a second logic component; a third die including a third logic component, the first, second, and third dice arranged in a stack, and the first, second, and third logic components coupled in series to form a portion of a. connection extending through at least one of the first, second, and third dice; and a module configured to transfer control information on the connection from the first die to the second die and from the second die to the third die, wherein the module is configured to assign a first identification to the first die when the control information is transferred to the first die, to assign a second identification to the second die when the control information is transferred to the second die, and to assign a third identification to the third die when the control information is transferred to the first third die.