Semiconductor light-emitting device, manufacturing method for the same and vehicle headlight

摘要

A semiconductor light-emitting device, a method for manufacturing the same and a vehicle headlight can include the light-emitting device, which is composed of a light-emitting structure including a transparent plate, at least one semiconductor light-emitting chip and a wavelength converting layer between the transparent plate and the light-emitting chip to emit various colored lights including white light. The light-emitting device can also include a mounting board mounting the light-emitting structure and a frame thereon, a reflective material disposed between the frame and the light-emitting structure and the transparent material located on the reflective material to prevent an occurrence of oil-bleeding phenomenon. Thus, the disclosed subject matter can provide the light-emitting device having a high reliability for the vehicle headlight and the like, which can be maintained at a high quality even when they have been used for a long time under harsh conditions, and methods of manufacturing such devices.

主权项

1. A semiconductor light-emitting device comprising:
a mounting board having a mounting surface; a sub mount board having a mount surface and a conductor pattern located adjacent the mount surface of the sub mount board, and the sub mount board being located adjacent the mounting surface of the mounting board; at least one semiconductor light-emitting chip having a top surface, a side surface and a bottom surface, and including chip electrodes adjacent the bottom surface, each of the chip electrodes electrically connected to a respective portion of the conductor pattern of the sub mount board via solder bumps; a transparent plate having a top surface, a side surface, a bottom surface and an edge portion located between the top surface and the side surface, the transparent plate being located over the top surface of the at least one semiconductor light-emitting chip so that the bottom surface of the transparent plate covers the top surface of the at least one semiconductor light-emitting chip; a wavelength converting layer having a side surface and including at least one phosphor, the wavelength converting layer disposed between the bottom surface of the transparent plate and the side surface of the at least one semiconductor light-emitting chip so that the side surface of the wavelength converting layer extends from the side surface of the at least one semiconductor light-emitting chip toward the bottom surface of the transparent plate; a frame located adjacent the mounting surface of the mounting board so as to surround the sub mount board, the at least one semiconductor light-emitting chip, the wavelength converting layer and the transparent plate; a reflective material having a top surface, a side surface and an end of the top surface, the top surface of the reflective material including at least one of a concave shape and a planer shape, the side surface including an inclined surface, the reflective material disposed at least between the frame and both a part of the side surface of the transparent plate and the side surface of the wavelength converting layer and between the bottom surface of the at least one semiconductor light-emitting chip and the mount surface of the sub mount board while surrounding the solder bumps, the inclined surface of the side surface of the reflective material contacting with the side surface of the wavelength converting layer and extending from the side surface of the at least one semiconductor light-emitting chip toward the bottom surface of the transparent plate, the end of the top surface of the reflective material contacting with the side surface of the transparent plate, and the reflective material having a hardness and configured as a resin including a reflective substance filler; and a transparent material having a top surface, an end of the top surface, a side surface, a bottom surface and a hardness different from the hardness of the reflective material, the transparent material disposed on the top surface of the reflective material so as to cover the whole top surface of the reflective material while the end of the top surface of the transparent material contacts with the side surface of the transparent plate, and the transparent material being configured as a resin including substantially no reflective substance filler.