Method for manufacturing semiconductor light emitting element, semiconductor light emitting element, lamp, electronic device and mechanical apparatus

摘要

A method for manufacturing a semiconductor light emitting element (1) which includes a first step of forming a first n-type semiconductor layer (12c) on a substrate (11) and a second step of sequentially forming a regrowth layer (12d) of the first n-type semiconductor layer (12c), a second n-type semiconductor layer (12b), a light emitting layer (13), and a p-type semiconductor layer (14) on the first n-type semiconductor layer (12c). In the step of forming the second n-type semiconductor layer (12b), a step (1) of supplying Si less than that forming the regrowth layer (12d) as a dopant to form a first layer of the second n-type semiconductor layer and a step (2) of supplying the Si more than that in the step (1) to form a second layer of the second n-type semiconductor layer are performed in this order.

主权项

1. A method for manufacturing a semiconductor light emitting element, comprising:
a first step of forming a first n-type semiconductor layer on a substrate in a first metal organic chemical vapor deposition apparatus; and a second step of sequentially forming a regrowth layer of the first n-type semiconductor layer, a second n-type semiconductor layer, a light emitting layer, and a p-type semiconductor layer including a p cladding layer and a p contact layer on the first n-type semiconductor layer in a second metal organic chemical vapor deposition apparatus, wherein, in the step of forming the second n-type semiconductor layer, a step (1) of supplying Si less than that forming the regrowth layer as a dopant to form a first layer of the second n-type semiconductor layer and a step (2) of supplying Si more than that in the step (1) to form a second layer of the second n-type semiconductor layer are performed in this order.