Integrated circuit packaging system with a shield and method of manufacture thereof

摘要

A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting a first integrated circuit over the substrate; forming an encapsulant around the first integrated circuit and over the substrate; and forming a shield structure within and over the encapsulant while simultaneously forming a vertical interconnect structure.

主权项

1. A method of manufacture of an integrated circuit packaging system comprising:
providing a substrate; mounting a first integrated circuit over the substrate; forming a ground ring pad on a first side of the substrate and adjacent to the first integrated circuit; forming a conductive pad on a periphery of the substrate, the ground ring pad between the conductive pad and the first integrated circuit; forming an encapsulant around the first integrated circuit and over the substrate; and forming a shield structure within and over the encapsulant while simultaneously forming a vertical interconnect structure, the shield structure in direct contact with the first integrated circuit and the shield structure is a continuous structure characteristic of a deposition process.