Folded stacked package and method of manufacturing the same

摘要

A folded stacked package and a method of manufacturing the same are provided. The folded stacked package includes a flexible board or substrate comprising first, second and third device packaging units, and first and second folding unit units. The flexible board has wiring patterns formed thereon; one or more active devices disposed in at least one of the first, second, and third device packaging units; and one or more passive devices disposed on a surface of each of the first and second device packaging units. The passive devices include one or more first passive devices disposed on the surface of the first device packaging unit and one or more second passive devices disposed on the surface of the second device packaging unit. The first and second passive devices do not overlap each other when the flexible board is folded at the folding unit.

主权项

1. A folded stacked package comprising:
a flexible board or substrate comprising a folding unit and first and second device packaging units connected by the folding unit and having wiring patterns formed thereon; one or more first devices embedded in the flexible board or substrate of the first and second device packaging units; and one or more second devices disposed on a surface of each of the first and second device packaging units, wherein the second devices disposed on the surface of the first device packaging unit and the second devices disposed on the surface of the second device packaging unit are configured not to overlap each other in response to the flexible board or substrate being folded at the folding unit so that the first and second packaging units face each other.