Suspension board with circuit and producing method thereof

摘要

A suspension board with circuit includes a metal supporting board, a first insulating layer laminated on a top surface of the metal supporting board, a second insulating layer laminated on a back surface of the metal supporting board, a first conductive pattern laminated on the surface of the first insulating layer and including a first terminal connected to the magnetic head, and a second conductive pattern laminated on the surface of the second insulating layer and including a second terminal. In a slider mounting region, the slider is mounted on the surface and an electronic element mounting space is formed. Respective end edges of the first and second insulating layers are spaced apart from and located at positions inwardly protruded in the electronic element mounting space from an end edge of the metal supporting board, and the second terminal is disposed to face the electronic element mounting space.

主权项

1. A suspension board with circuit for mounting thereon a slider on which a magnetic head is mounted and an electronic element provided in a vicinity of the magnetic head, comprising:
a metal supporting board; a first insulating layer laminated on a top surface of the metal supporting board; a second insulating layer laminated on a back surface of the metal supporting board; a first conductive pattern laminated on the top surface side of the first insulating layer and including a first terminal electrically connected to the magnetic head; and a second conductive pattern laminated on the back surface side of the second insulating layer and including a second terminal electrically connected to the electronic element, wherein a slider mounting region for mounting thereon a slider, wherein in the slider mounting region, the slider is mounted on the top surface side, in the slider mounting portion, an electronic element mounting space in which the electronic element is disposed is formed so as to extend through the metal supporting board in a top-back direction extending between the top and back surfaces thereof, when projected in the top-back direction, respective end edges of the first insulating layer and the second insulating layer are spaced apart from each other in a thickness direction by a thickness of the metal supporting board and located at positions inwardly protruded in the electronic element mounting space from an end edge of the metal supporting board, and the second terminal is disposed so as to face the electronic element mounting space.