Patterning process

摘要

A patterning process comprises (a) providing at least one substrate having at least one major surface; (b) providing at least one patterning composition comprising at least one functionalizing molecule that is a perfluoropolyether organosulfur compound; (c) applying the patterning composition to the major surface of the substrate in a manner so as to form at least one functionalized region and at least one unfunctionalized region of the major surface; and (d) etching at least a portion of the unfunctionalized region.

主权项

1. A process comprising (a) providing at least one substrate having at least one major surface comprising at least one elemental metal, at least one metal alloy, at least one metal-containing compound, or a combination thereof; (b) providing at least one patterning composition comprising at least one functionalizing molecule that is a perfluoropolyether organosulfur compound comprising at least one perfluoropolyether segment selected from F[CF(CF3)CF2O]aCF(CF3)—, wherein a has an average value of 4 to 20, and —CF(CF3)(OCF2CF(CF3)bOCF2CF2CF2CF2O(CF(CF3)CF2O)cCF(CF3)—, wherein b+c has an average value of 4 to 15; (c) applying said patterning composition to said major surface of said substrate in a manner so as to form at least one functionalized region and at least one unfunctionalized region of said major surface; and (d) etching at least a portion of said unfunctionalized region.