Laser welded bonding pads for piezoelectric print heads

摘要

An ink jet print head can be formed using a laser to melt a plating layer interposed between a piezoelectric actuator and a circuit layer bump. The plating layer can be formed on the circuit layer bump, the piezoelectric actuator, or both, and a laser beam output by the laser is used to melt the plating layer to provide a laser weld. In another embodiment, the circuit layer bump or the trace itself functions as the plating layer, which is melted using a laser to provide the laser weld.

主权项

1. A method for forming an ink jet print head, comprising:
physically contacting a plating layer on a conductive bump of a conductive circuit layer of a circuit with a piezoelectric actuator of a print head subassembly; heating the conductive bump of the circuit layer and the piezoelectric actuator with a laser beam to melt the plating layer, wherein the plating layer is interposed between the conductive bump and the piezoelectric actuator; and cooling the melted plating layer to solidify the melted plating layer, wherein the solidified plating layer provides a laser weld which physically connects the conductive circuit layer to the print head subassembly and electrically couples the conductive circuit layer to the print head subassembly.