Chip assembly and chip assembling method

摘要

A chip assembly includes a PCB and a chip positioned on the PCB. The PCB includes a number of first bonding pads. Each bonding pad includes two soldering balls formed thereon. The chip includes a number of second bonding pads, and each second bonding pad corresponds to a respective first bonding pad. The two soldering balls of each first bonding pad are electrically connected to a corresponding second bonding pad via two bonding wires, and the bonding wires are bonded to the second corresponding bonding pad by a wedge bonding manner.

主权项

1. A chip assembly, comprising:
a PCB comprising a plurality of first bonding pads, each first bonding pad comprising two soldering balls positioned thereon; and a chip positioned on the PCB, the chip comprising a plurality of second bonding pads, each second bonding pad corresponding to a respective one of the first bonding pads;wherein the two soldering balls of each first bonding pad are electrically connected to a corresponding second bonding pad via two bonding wires, the two bonding wires are bonded to the corresponding second bonding pad by a wedge bonding manner.