发明名称 Arraratus for moving upward and downward chuck stage of bonding device
摘要 PURPOSE: An apparatus for elevating the chuck stage of a bonding unit is provided to improve the efficiency of a bonding operation by forming a structure which stands a vertical loading with respect to the chuck stage. CONSTITUTION: An eccentric cam(10) is rotated by a driving motor(11). A horizontal slider(20) horizontally moves by the rotation of the eccentric cam. A chuck stage(30) is vertically elevated by the movement of the horizontal slider. A plurality of horizontal sliders is prepared. A linkage connects the horizontal sliders. The horizontal sliders are simultaneously driven by the rotation of the eccentric cam.
申请公布号 KR101450820(B1) 申请公布日期 2014.10.14
申请号 KR20080107865 申请日期 2008.10.31
申请人 发明人
分类号 H01L21/677;H01L21/687 主分类号 H01L21/677
代理机构 代理人
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