Semiconductor package with temperature sensor

摘要

According to an exemplary embodiment, a dual compartment semiconductor package includes a conductive clip having first and second compartments. The first compartment is electrically and mechanically connected to a top surface of the first die. The second compartment electrically and mechanically connected to a top surface of a second die. The dual compartment semiconductor package also includes a groove formed between the first and second compartments, the groove preventing contact between the first and second dies. The dual compartment package electrically connects the top surface of the first die to the top surface of the second die. The first die can include an insulated-gate bipolar transistor (IGBT) and the second die can include a diode. A temperature sensor can be situated adjacent to, over, or within the groove for measuring a temperature of the dual compartment semiconductor package.

主权项

1. A dual compartment semiconductor package comprising:
a conductive clip having first and second compartments; said first compartment electrically and mechanically connected to a top surface of said first die; said second compartment electrically and mechanically connected to a top surface of said second die; a groove formed between said first and second compartments; said dual compartment package electrically connecting said top surface of said first die to said top surface of said second die; a temperature sensor situated adjacent to said groove for measuring a temperature of said dual compartment semiconductor package.