发明名称 Metal gate structure
摘要 The metal gate structure of the present invention can include a TiN complex, and the N/Ti proportion of the TiN complex is decreased from bottom to top. In one embodiment, the TiN complex can include a single TiN layer, which has an N/Ti proportion gradually decreasing from bottom to top. In another embodiment, the TiN complex can include a plurality of TiN layers stacking together. In such a case, the lowest TiN layer has a higher N/Ti proportion than the adjusted TiN layer.
申请公布号 US8860150(B2) 申请公布日期 2014.10.14
申请号 US200912634689 申请日期 2009.12.10
申请人 United Microelectronics Corp. 发明人 Lin Chin-Fu;Ho Nien-Ting;Lin Chun-Hsien;Yu Chih-Hao;Chou Cheng-Hsien
分类号 H01L21/70;H01L29/78;H01L29/66;H01L21/28;H01L21/8238;H01L29/51;H01L29/49 主分类号 H01L21/70
代理机构 代理人 Hsu Winston;Margo Scott
主权项 1. A metal gate structure, comprising: a gate dielectric layer; and a gate electrode, comprising a first work function metal layer, disposed on the gate dielectric layer; anda second work function metal layer, disposed on the first work function metal layer; wherein both the first and the second work function metal layers are substantially composed by a first element and a second element, a ratio of the first element to the second element of the first work function metal layer is different from a ratio of the first element to the second element of the second work function metal layer, a ratio of the second element to the first element decreases along with a thickness of the first work function metal layer or a thickness of the second work function metal layer from bottom to top, and a molecular composition of the first work function metal layer and a molecular composition of the second work function metal layer are not continuous at an interface between the first work function metal layer and the second work function metal layer.
地址 Science-Based Industrial Park, Hsin-Chu TW