Photosensitive modified polyimide resin composition and use thereof

摘要

Disclosed are: a photosensitive modified polyimide resin composition having photo-fabrication property, which is excellent in the electric properties and adhesion as well as in the heat resistance, flexibility, bending property, low warping, chemical resistance and storage stability; a resin film formed from the composition; and a printed circuit board, flexible printed circuit board (FPC) and the like which comprises the film as an insulating protective film and/or interlayer insulation film. The photosensitive modified polyimide resin composition comprises a modified polyimide of a specific structure having a flexible structure such as polycarbonate; a photosensitizer; a curing agent; and a solvent.

主权项

1. A photosensitive modified polyimide resin composition, which comprises a modified polyimide represented by the following Formula (I): (wherein each R independently represents a C1-C18 alkylene group; each X independently represents a carbonate group, ester group or urethane group; each Y independently represents a C1-C18 alkylene group or arylene group; A represents a divalent organic group which is the part of a diamine other than the amino groups thereof; Z and Z′ represent a tetravalent organic group which is the part of a tetracarboxylic acid other than the carboxyl groups thereof; at least one of A, Z and Z′ has a free hydroxyl group(s) and/or carboxyl group(s); and m, n, p and q each independently represents an integer of 1 to 20); and a photosensitizer.