发明名称 Substrate processing apparatus, control method adopted in substrate processing apparatus and program
摘要 A substrate processing apparatus according to the present invention comprises a plurality of processing chambers, discharge systems each provided in conjunction with one of the processing chambers and a common discharge system connected with the discharge systems of at least two processing chambers among the discharge systems provided in conjunction with the individual processing chambers. The common discharge allows a switch-over between a scrubbing common discharge system that discharges discharge gas from each processing chamber after scrubbing the discharge gas at a scrubbing means and a non-scrubbing common discharge system that directly discharges the discharge gas from the discharge system of the processing chamber without scrubbing at the scrubbing means. In this substrate processing apparatus, switch-over control is executed to select either the scrubbing common discharge system of the non-scrubbing common discharge system in correspondence to the type of processing executed in the processing chamber.
申请公布号 US8859046(B2) 申请公布日期 2014.10.14
申请号 US201113271050 申请日期 2011.10.11
申请人 Tokyo Electron Limited 发明人 Nakamura Hiroshi;Kobayashi Toshiyuki;Hayasaka Shinichiro;Kaise Seiichi
分类号 G06F19/00;G05D7/06;H01L21/67 主分类号 G06F19/00
代理机构 Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P. 代理人 Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
主权项 1. An exhaust control method for controlling a substrate processing apparatus including a plurality of processing chambers, said exhaust control method comprising: determining, by using a control unit controlling the plurality of processing chambers in communication with a plurality of pressure sensors, a plurality of discharge systems, a first switchover valve that switches between discharge through a main discharge system and discharge through an auxiliary discharge system, and a second switchover valve that switches between discharge through a scrubbing common discharge system and discharge through a non-scrubbing common discharge system, whether or not processing to be executed in one of the plurality of processing chambers is a predetermined type of processing based upon a pressure in said one of the processing chambers initially measured via one of the pressure sensors; opening, by using the control unit, the second switchover valve so as to release exhaust gas from a common discharge system connected to the plurality of discharge systems through the non-scrubbing common discharge system without scrubbing the exhaust gas upon determining that the processing to be executed in the processing chamber is a first processing that is executed in a pressure condition higher than a predetermined pressure and that is executed with at least one of a process gas or an inert gas containing no toxics being evacuated from at least one of the processing chambers; and closing, by using the control unit, the second switchover valve, so as to scrub exhaust gas from the common discharge system through the scrubbing common discharge system upon determining that the processing to be executed in the processing chamber is a second processing that is executed in a pressure condition lower than the predetermined pressure and that is executed with said process gas containing said toxics being evacuated from at least one of the processing chambers; executing exclusivity control, under which while the first processing is in progress in any of the processing chambers, the second processing is not executed in the other processing chambers, and while the second processing is in progress in any processing chamber, the first processing is not executed in the other processing chambers.
地址 Tokyo JP