| 摘要 |
The present application relates to a curable composition and a use thereof. The curable composition of the present application can provide a hardened material which has excellent processability, workability, adhesive properties, etc. and is free from surface stickiness. The curable composition of the present application has excellent heat resistance and crack resistance, low gas permeability, etc. The curable composition of the present application, for example, is applied to a semiconductor device and allows the performance of the semiconductor device to be stably maintained even when the semiconductor device is used at high temperatures for a long period of time. |
