发明名称 Gate constructions of recessed access devices and methods of forming gate constructions of recessed access devices
摘要 A method of forming a gate construction of a recessed access device includes forming a pair of sidewall spacers laterally over opposing sidewalls of a gate dielectric and elevationally over first conductive gate material. The gate dielectric, the first conductive gate material, and the sidewall spacers are received within a trench formed in semiconductive material. Second conductive gate material is deposited within the semiconductive material trench between the pair of sidewall spacers in electrical connection with the first conductive gate material. Other implementations are disclosed, including recessed access device gate constructions independent of method of manufacture.
申请公布号 US8859367(B2) 申请公布日期 2014.10.14
申请号 US201012833071 申请日期 2010.07.09
申请人 Micron Technology, Inc. 发明人 Mathew Suraj;Guha Jaydip
分类号 H01L21/336;H01L27/108;H01L29/423;H01L29/66;H01L29/78;H01L21/28 主分类号 H01L21/336
代理机构 Wells St. John, P.S. 代理人 Wells St. John, P.S.
主权项 1. A method of forming a gate construction of a recessed access device, comprising: forming a pair of non-dielectric sidewall spacers laterally over opposing sidewalls of a gate dielectric and elevationally over first conductive gate material; the gate dielectric, the first conductive gate material, and the sidewall spacers being within a trench formed in semiconductive material, the sidewall spacers projecting elevationally outward of the semiconductive material in which the trench is formed and projecting elevationally outward of the gate dielectric; and depositing second conductive gate material within the semiconductive material trench between the pair of sidewall spacers in electrical connection with the first conductive gate material.
地址 Boise ID US