| 摘要 |
The present invention is a compact, highly efficient method for convectively cooling substrates, where the substrates contain light emitting diodes (LEDs) or other highly dissipative electronic components. The methodology exhibits very low acoustic noise, extended operating life of moving parts and minimum susceptibility to dust. Also, the improved cooling methodology for high brightness light emitting diodes employs one or more high-density, high-surface-area, single or multiple-element metallic structures having superior heat-transfer properties in the presence of low-speed, minimally turbulent air flow, and enhanced electronic-power-management. |
| 主权项 |
1. A cooling apparatus for highly dissipative LEDs comprises of, a vented cylindrical cooling enclosure (19);
a heat sink (1); a cooling fan (7); a voltage distribution and regulation system (8), (9), (10), (11); the heat sink (1) comprises of a mounting surface (4) for a plurality of LEDs (6) or a LED substrate (5) and a plurality of protrusions (2), (3); and the heat sink (1), the cooling fan (7), and the voltage distribution and regulation system (8), (9), (10), (11) being housed and fixed inside the vented cylindrical cooling enclosure (19); the cylindrical cooling enclosure (19) comprises of an inner cylinder (20), an outer cylinder (21), a plurality of baffles (22), a housing wall (15), a plurality of intake vents (17) and a plurality of exhaust vents (18); the plurality of intake vents (17) being located in between the inner cylinder (20) and the outer cylinder (21); the plurality of exhaust vents (18) being located above the cooling fan (7); the plurality of exhaust vents (18) being located in between the inner cylinder (20) and the heat sink (1); the plurality of baffles (22) being parallel to the heat sink (1); and the inner cylinder (20), the outer cylinder (21), the housing wall (15) and the plurality of baffles (22) creating channels to help direct and control air flow within the vented cylindrical cooling enclosure (19). |
