发明名称 |
DEVICE MANUFACTURED BY ROOM-TEMPERATURE BONDING, DEVICE MANUFACTURING METHOD, AND ROOM-TEMPERATURE BONDING APPARATUS |
摘要 |
An inter-substrate material layer is formed between a first substrate and a second substrate to generate a bonding strength. A plurality of metal elements are present in the inter-substrate material layer. An interface element existence ratio of the plurality of metal elements is 0.07 or above. A device can be obtained in which substrates difficult to bond (for example, SiO2 substrates) are bonded at room-temperature to have practical bonding strength. |
申请公布号 |
CA2669733(C) |
申请公布日期 |
2014.10.14 |
申请号 |
CA20072669733 |
申请日期 |
2007.05.30 |
申请人 |
MITSUBISHI HEAVY INDUSTRIES, LTD. |
发明人 |
UTSUMI, JUN;GOTO, TAKAYUKI;IDE, KENSUKE;FUNAYAMA, MASAHIRO;TAKAGI, HIDEKI |
分类号 |
B23K20/00;B81C3/00 |
主分类号 |
B23K20/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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