Metallic sub-collector for HBT and BJT transistors

摘要

A heterojunction bipolar transistor having an emitter, a base, and a collector, the heterojunction bipolar transistor including a metallic sub-collector electrically and thermally coupled to the collector wherein the metallic sub-collector comprises a metallic thin film, and a collector contact electrically connected to the metallic sub-collector.

主权项

1. A bipolar transistor having an emitter, a base, and a collector, the bipolar transistor comprising:
a substrate; a collector contact; a metallic subcollector coupled to the collector contact, and the metallic sub-collector electrically and thermally coupled to the collector, wherein the metallic sub-collector comprises a metallic thin film; an adhesion layer between the substrate and the metallic sub-collector, the adhesion layer bonded directly to the substrate and in direct contact with the substrate and bonded directly to the metallic sub-collector and in direct contact with the metallic sub-collector, wherein the adhesion layer consists of a single material; and a thermal via coupled to the metallic subcollector and coupled to the substrate for thermally coupling the metallic sub-collector to the substrate, wherein the thermal via contacts a top surface of the substrate through an opening in the adhesion layer.