LED module

摘要

An LED module A1 includes an LED chip 1, a lead group 4 including a lead 4A on which the LED chip 1 is mounted and a lead 4B spaced apart from the lead 4A, a resin package 2 covering part of the lead group 4, and mounting terminals 41 and 42 provided by part of the lead group 4 that is exposed from the resin package 2 and spaced apart from each other in direction x. The LED module further includes a mounting terminal 43 spaced apart from the mounting terminal 41 in direction y, and a mounting terminal 44 spaced apart from the mounting terminal 42 in direction y. This arrangement allows the LED module A1 to be mounted at a correct position on a circuit board.

主权项

1. An LED module comprising:
an LED chip including an upper surface and a lower surface; a first lead including a pad on which the LED chip is mounted with the lower surface of the LED chip being electrically connected to the first lead; a second lead spaced apart from the first lead; a first wire connecting the upper surface of the LED chip and the second lead to each other; a third lead spaced apart from both the first lead and the second lead; and a resin package covering part of each of the first, the second and the third leads; wherein the first, the second and the third leads comprise portions exposed from the resin package that provide a first, a second, a third and a fourth mounting terminals, the first and the second mounting terminals being spaced apart from each other in a first direction, the third mounting terminal being spaced apart from the first mounting terminal in a second direction perpendicular to the first direction, the fourth mounting terminal being spaced apart from the first mounting terminal and the second mounting terminal, wherein the second lead includes an enlarged portion adjacent to the first lead and protruding in the second direction, the second lead also including a pad connected to the enlarged portion, the enlarged portion of the second lead being greater in width measured in the second direction than the portion of the second lead exposed from the resin package, wherein the third lead includes an enlarged portion adjacent to the first lead and protruding in the second direction, the third lead also including a pad connected to the enlarged portion of the third lead, the enlarged portion of the third lead being greater in width measured in the second direction than the portion of the third lead exposed from the resin package, wherein the enlarged portion of the second lead and the enlarged portion of the third lead protrude to face each other in the second direction, wherein the pad of the first lead overlaps, as viewed in the second direction, both the pad of the second lead and the pad of the third lead.