Package carrier

摘要

A package carrier includes a substrate, first and second insulation layers, first and second patterned circuit layers, at least one first and second conductive through holes, a heat dissipation channel, an adhesive layer and a heat conducting element. The first and second patterned circuit layers are respectively disposed on the first and second insulation layers which are respectively disposed on upper and lower surfaces of the substrate. The heat dissipation channel at least passes through the first insulation layer, the first and second patterned circuit layers, and the substrate. The first and second conductive through holes electrically connect with the substrate, the first and second patterned circuit layers. At least two opposite side surfaces of the heat conducting element each includes at least one convex portion or at least one concave portion. The heat conducting element is mounted in the heat dissipation channel via the adhesive layer.

主权项

1. A package carrier comprising:
a substrate having an upper surface and a lower surface opposite to each other; a first insulation layer disposed on the upper surface of the substrate; a first patterned circuit layer disposed on the first insulation layer and exposing a portion of the first insulation layer; at least one first conductive through hole disposed in the first insulation layer and electrically connecting the substrate and the first patterned circuit layer; a second insulation layer disposed on the lower surface of the substrate; a second patterned circuit layer disposed on the second insulation layer and exposing a portion of the second insulation layer; at least one second conductive through hole disposed in the second insulation layer and electrically connecting the substrate and the second patterned circuit layer; a heat dissipation channel at least passing through the first insulation layer, the first patterned circuit layer, the substrate and the second insulation layer; a heat conducting element disposed in the heat dissipation channel, wherein at least two opposite side surfaces of the heat conducting element each comprises at least one convex portion or at least one concave portion, and the first patterned circuit layer and the second patterned circuit layer further extend to dispose on an upper surface and a lower surface of the heat conducting element; and an adhesive layer disposed between the heat conducting element and the heat dissipation channel, wherein the heat conducting element is mounted in the heat dissipation channel via the adhesive layer.