| 摘要 |
<p>A method for manufacturing a conductive material structure can manufacture a conductive material structure in a short time to be appropriate for removing an obstacle of commercialization, that is, prolonged plating time, and for realizing three-dimensional (3D) mounting by a penetrating electrode. The method for manufacturing a conductive material comprises: a step of forming a conductive film (14) on the entire surface of a substrate (W) where a penetrating electrode concave unit (12) is formed, including the surface of the concave unit (12); a step of forming a resist pattern (30) at a preset position on the surface of the substrate (W); a step of burying a first plating film (36) inside the penetrating electrode concave unit (12) by performing first electroplating in a first plating condition using the conductive film (14) as a power feed layer; and a step of growing a second plating film (38) on the conductive film (14) and a first plating film (36) exposed to a resist opening unit (32) of the resist pattern (30) by performing second electroplating in a second plating condition using the conductive film (14) and the first plating film (36) as a power feed layer, upon completion of burying the first plating film (36) in the penetrating electrode concave unit (12).</p> |
